STMicroelectronics announces (i) a US$1.5 billion dual-tranche offering of New Convertible Bonds and (ii) the early redemption of its 2027 Convertible Bonds

STMicroelectronics announced a US$1.5 billion offering of senior unsecured convertible bonds in two tranches (5-year and 7-year maturities) with low coupon rates (0.00%-1.125%). The proceeds will be used for general corporate purposes, including early redemption of its outstanding US$750 million 2027 convertible bonds. Settlement is expected on June 23, 2026, with conversion premiums ranging from 47.5%-55% over the volume-weighted average share price.