Lumentum to Demonstrate DWDM ELSFP at ECOC 2026: What's Ahead?

Lumentum Holdings is expanding its optical connectivity solutions for AI data centers, planning to demonstrate an eight-wavelength DWDM ELSFP module at ECOC 2026 for co-packaged optics (CPO) and near-packaged optics (NPO) architectures. The company expects ultra-high-power laser chip demand to ramp in 2H 2027 and is expanding manufacturing capacity across Japan and the U.S. However, it faces intensifying competition from Marvell Technology and Applied Optoelectronics in the CPO/NPO market.