ASML Expands High-NA Ties With Samsung and Intel as AI Demand Builds

ASML is expanding High-NA EUV lithography collaborations with Samsung and Intel to meet growing AI-driven chip manufacturing demands. Intel has already moved High-NA into production for Panther Lake and qualified it for 18A layers, while Samsung plans to introduce the technology into DRAM high-volume manufacturing by 2028. However, broader adoption remains uncertain as commercialization depends on individual customer qualification and manufacturing decisions.