Arteris、マルチダイ／チップレットベース アーキテクチャへの業界移行を加速

Arteris announced an expanded multi-die product portfolio including the new FlexGen Multi-Die solution, enabling semiconductor manufacturers to transition from monolithic SoC designs to chiplet-based architectures while maintaining QoS and design flexibility. The solution addresses challenges in AI, HPC, and consumer electronics by seamlessly extending NoC connectivity across chip boundaries, reducing PHY area and power consumption by up to 50%.