Arteris 加速行业向 Multi-Die 芯粒架构转型

Arteris announced an expansion of its Multi-Die product portfolio to help semiconductor companies transition from monolithic SoCs to chiplet architectures for AI, HPC, and consumer electronics. The new FlexGen Multi-Die NoC IP extends on-chip network connectivity across chip boundaries, reducing PHY area, power, and I/O requirements by up to 50%. The expanded solution includes FlexGen Multi-Die, Ncore Multi-Die, Magillem integration automation, and Cycuity hardware security verification, with support from major partners including AMD, Socionext, Cadence, Synopsys, and others.