Arteris, 업계의 Multi-Die 칩렛 기반 아키텍처 전환 가속화

Arteris announced an expanded Multi-Die portfolio including the new FlexGen Multi-Die product to help semiconductor companies transition from monolithic SoC designs to chiplet-based architectures. The solution extends Network-on-Chip (NoC) connectivity across die boundaries while maintaining QoS and architectural flexibility, addressing data movement challenges in AI and high-performance computing systems.