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Alchip Technologies Showcases Advanced ASIC Design and Packaging at AI Infra Summit 2026
GlobeNewswire Inc.·
Alchip Technologies will exhibit its leading-edge semiconductor process technology and advanced packaging capabilities at AI Infra Summit 2026. The company highlights its 3nm designs in production and 2nm designs in development, along with advanced 3DIC packaging solutions. With over 650 successful tape-outs since 2003 and 90% of designs using sub-7nm technologies, Alchip continues to focus on AI, high-performance computing, and networking applications.
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