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GlobalFoundries qualifies SLATE™ advanced packaging technology on 9SW platform for next-generation radio frequency applications
GlobeNewswire Inc.·
GlobalFoundries announced production readiness of its SLATE wafer-to-wafer bonding technology on the 9SW RF-SOI platform, enabling advanced 3D integration for compact cellular front-ends. The technology can reduce die size by up to 45% and is expected to ramp to volume production by H2 2027 at GF's Singapore facility. SLATE represents a significant advancement in RF integration for 5G and satellite communications applications.
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